> Hotmelt / Reactive-Hotmelt

Hotmelt / Reactive-Hotmelt

Hot melt adhesives are 100% solids that do not contain solvents or water. Hot melt adhesives melt to viscous liquids at higher temperatures and solidify again when cooled down. This purely physical effect of thermoplastic hot melt adhesives can be combined with a second curing process. These so-called reactive hot melt adhesives additionally cure with the humidity present in the environment to no longer smeltable thermosets.

Typical properties Typical applications

Typical properties

Mechanical properties adjustable by selection of the base polymer
Excellent adhesion to a wide range of substrates
Low thermal degradation
Adjustable Open Time
Nearly odorless
Reduced stringing
High yield
Nearly colorless

Typical applications

Bonding of electronic components