Hotmelt / Reactive-Hotmelt

Hot melt adhesives are 100% solids that do not contain solvents or water. Hot melt adhesives melt to viscous liquids at higher temperatures and solidify again when cooled down. This purely physical effect of thermoplastic hot melt adhesives can be combined with a second curing process. These so-called reactive hot melt adhesives additionally cure with the humidity present in the environment to no longer smeltable thermosets.

Typical properties Typical applications

Typical properties

  • Mechanical properties adjustable by selection of the base polymer
  • Excellent adhesion to a wide range of substrates
  • Low thermal degradation
  • Adjustable Open Time
  • Nearly odorless
  • Reduced stringing
  • High yield
  • Nearly colorless

Typical applications

  • Bonding of electronic components